Digi XBee 4 BLU Development Kit
Complete Digi XBee 3 BLU development platform to integrate compact, flexible Bluetooth Low Energy connectivity for IoT devices
The Digi XBee® 3 BLU Development Kit offer an easy-to-use Bluetooth® development platform for designers, OEMs and solution providers supporting Bluetooth 5.4 Low Energy for industrial wireless IoT connectivity. The module supports an industrial temperature range of −40 ºC to 85 ºC (−40 ºF to 185 ºF) making it robust for a variety of industrial applications.
The pre-certified modules comes in the classic XBee form factors (MMT and through-hole) offering MicroPython programmability, beaconing, Bluetooth sensor support and the Digi XBee Mobile App to accelerate use in industrial wireless projects.
Pre-certified modules and tools for development
The pre-certified modules offer MicroPython programmability, beaconing, Bluetooth sensor support and the Digi XBee Mobile App to accelerate use in industrial wireless projects.
Die Standard-API-Frames und AT-Befehle von Digi XBee sowie MicroPython und Digi XBee Studio erleichtern die Einrichtung, Konfiguration und den Test von Modulen oder die Aktualisierung ihrer Funktionalität.
Digi XBee Bluetooth Low Energy modules are a key offering in the Digi XBee ecosystem of wireless modules, adapters, tools and software — all engineered to accelerate product and application development, deployment and management.
Built-in Digi TrustFence® security, identity and data privacy features use multiple layers of control to protect against new and evolving cyber threats. Bluetooth Low Energy also adds security via pairing & bonding, encrypted advertising along with existing XBee security including secure boot, hardware cryptographic acceleration and true random number generation.
Nachgewiesene Erfahrung und fachkundige Unterstützung
Our decades of embedded experience and millions of deployed devices tell our story; Digi is a trusted solutions provider dedicated to simplifying the way OEMs design, build, deploy and maintain secure connected products.
Digi Wireless Design Services (WDS) provides additional connectivity integration support, certification assistance, and custom design and build services to get your products to market smarter and faster, and support you wherever you are along your development path.
Hauptmerkmale, Vorteile und Anwendungen
- Designed for a range of use cases, from maker projects to industrial applications
- Industrial-rated on a Bluetooth module
- Integrierte MicroPython-Programmierbarkeit für Edge-Computing
- Bluetooth® Low Energy for beaconing, connecting to sensors and local configuration using the Digi XBee Mobile app
- Easily detect modules and connect to smart devices
- Geringe Leistungsaufnahme optimiert für lange Batterielebensdauer
- Integriert mit Digi TrustFence®Sicherheitsrahmen
- Manage, configure and test with Digi XBee Studio
- Accelerate development with Digi IoT Mobile SDK
- Digi XBee API functionality and support
- Over-the-air (OTA) firmware updates with the Digi XBee Mobile app
- Complete Bluetooth Low Energy 5.4 software stack
Der Bausatz enthält:
- (2) Digi XBee 3 BLU modules: chip antenna, u.fl antenna
- (1-2) XBIB interface board
- (1) Antenna (u.fl connector)
- Digi XBee Studio and Digi XBee Tools
- Additional documentation and examples
Digi XBee 3 BLU Development Kit
Spezifikationen |
Digi XBee 3 BLU |
BLUETOOTH® LEISTUNG |
TRANSCEIVER-CHIPSATZ |
Silicon Labs EFR32MG SoC |
BLUETOOTH LOW ENERGY VERSION |
Supports Bluetooth Low Energy 5.4 and capable of interoperating with Bluetooth Low Energy 5.4 devices that support 1M and 2M PHY |
MAXIMUM RF DATA RATE |
1 Mbps with 1M PHY and 2 Mbps with 2M PHY |
INNEN-/STADTBEREICH* |
Bis zu 15 m (49 ft) |
OUTDOOR/RF LINE-OF-SIGHT REICHWEITE* |
Bis zu 300 m (984 ft) |
STROMÜBERTRAGUNG |
+8 dBm |
EMPFÄNGEREMPFINDLICHKEIT (1% PRO) |
−97 dBm |
FEATURES |
SERIELLE DATENSCHNITTSTELLE |
UART, SPI |
KONFIGURATIONSMETHODE |
API oder AT-Befehle, lokal oder over-the-air (OTA) |
FREQUENZBAND |
ISM 2,4 GHz |
FORM-FAKTOR |
Micro (MMT), through-hole (TH) |
STÖRFESTIGKEIT |
FSK (Frequency-shift keying) |
ADC-EINGÄNGE |
(4) 10-Bit ADC-Eingänge |
DIGITALE E/A |
13 |
ANTENNENOPTIONEN |
Micro: U.FL antenna, RF pad, chip antenna
Through-hole: PCB antenna, U.FL connector |
BETRIEBSTEMPERATUR |
-40 ºC bis 85 ºC (-40 ºF bis 185 ºF) |
ABMESSUNGEN (L X B X H) |
Micro: 13 mm x 19 mm x 2 mm (0.533 in x 0.76 in x 0.087 in)
Through-hole: 2.438 cm x 2.761 cm (0.96 in x 1.087 in) |
SPEICHER |
1 MB / 96 kB RAM |
VERNETZUNG UND SICHERHEIT |
PROTOKOLL |
Bluetooth Low Energy 5.4 |
ENKRYPTION |
128/256-Bit AES |
ZUVERLÄSSIGE PAKETZUSTELLUNG |
Wiederholungen/Bestätigungen |
IDS |
PAN-ID und Adressen, Cluster-IDs und Endpunkte (optional) |
KANÄLE |
40 channels |
SICHERHEIT |
Digi TrustFence security with secure boot and protected JTAG |
KONFIGURATIONSWERKZEUGE |
Digi XBee Studio and Digi XBee Mobile App |
EMBEDDED PROGRAMMABILITY/td> |
MicroPython |
LEISTUNGSBEDARF |
VERSORGUNGSSPANNUNG |
1.71 - 3.8 V |
SENDESTROM |
32 mA bei 3,3 V, +8 dBm |
EMPFANGSSTROM |
13.5 mA |
IDLE CURRENT |
7.5 mA |
SCHLAFSTROM |
8 µA bei 25 ºC (77 ºF) |
BEHÖRDLICHE GENEHMIGUNGEN UND ZULASSUNGEN** |
FCC, IC (NORDAMERIKA) |
Vollständig |
ETSI (EUROPA) |
Vollständig |
GARANTIE |
PRODUKTGARANTIE |
1-Jahr |
*Die geschätzte Reichweite basiert auf Freiluftgelände mit begrenzten Störquellen. Die tatsächliche Reichweite variiert je nach Sendeleistung, Ausrichtung von Sender und Empfänger, Höhe der Sendeantenne, Höhe der Empfangsantenne, Wetterbedingungen, Störquellen in der Umgebung und Gelände zwischen Empfänger und Sender, einschließlich Innen- und Außenstrukturen wie Wände, Bäume, Gebäude, Hügel und Berge.
**Besuchen Sie die
Produktzertifizierungen für aktuelle Updates.