Digi ConnectCore System-on-Module Single Board Computers Entwicklungskits

Digi ConnectCore MP2

Demnächst verfügbar

Versatile, secure, wireless system-on-module with NPU and ISP for edge AI and computer-vision applications and complete Linux support in Digi SMTplus form factor

 
  • Industrietaugliche, skalierbare, eingebettete SOM-Plattform
  • NPU and ISP providing edge AI and computer-vision capabilities
  • Vorzertifiziertes Dual-Band Wi-Fi 5 (802.11ac) und Bluetooth® 5.2
  • Energiemanagement mit Hardware- und Software-Unterstützung
  • Digi SMTplus® form factor (30 x 30 mm) for ultimate reliability
  • Seamless cellular modem and Digi XBee® integration
  • Digi ConnectCore® Cloud Services for remote access, device management, OTA firmware updates and IoT application enablement
  • Digi Embedded Yocto Linux and Digi TrustFence® security support
  • Schlüsselfertige Entwicklungsdienste von Digi WDSverfügbar

Digi ConnectCore® MP2 is a versatile, secure and cost-effective wireless system-on-module (SOM) designed for industrial applications and smart connected devices. STMicroelectronics’ STM32MP25 adds a neural processing unit (NPU) and image signal processor (ISP) for edge AI and computer vision applications. The fully integrated wireless connectivity, time-sensitive networking (TSN) and the compact SMTplus® form factor (30 x 30 mm) make it ideal for small portable devices and Industry 4.0. The SOM is designed for maximum power efficiency to support battery powered applications.

Digi ConnectCore MP25 offers industrial-rated design for longevity in demanding 24/7/365 operation and 10+ year product lifecycles, backed by Digi’s industry-leading 3-year warranty. Digi Embedded Yocto® combined with powerful Digi ConnectCore Cloud Services and Digi ConnectCore Security Services, makes Digi ConnectCore MP25 a complete solution for creating and maintaining secure connected devices throughout their lifecycle.

The scalable Digi ConnectCore MP2 module family provides a wide range of wireless connectivity options with pre-certified 802.11ac Wi-Fi 5 and Bluetooth 5.2, along with PCIe Gen2, USB 3.0, CAN-FD and Gigabit Ethernet with TSN support. In addition, it includes high end graphics capabilities such as a 3D GPU, video encoder and decoder (VPU), high resolution MIPI, LVDS or parallel display interfaces as well as a MIPI camera port with a image signal processor (ISP).

Embedded device security is a critical design aspect for connected IoT applications. Digi ConnectCore SOM solutions provide built-in security with Digi TrustFence®, a fully integrated IoT security framework simplifying the process of securing connected devices. Digi ConnectCore Cloud Services, Digi ConnectCore Security Services and Expert Support provide additional capabilities for development, deployment and maintenance throughout the entire product lifecycle.

Our decades of embedded experience and millions of deployed devices tell our story; Digi is a trusted solutions provider dedicated to simplifying the way OEMs design, build, deploy and maintain secure connected products. Digi Wireless Design Services (WDS) is an engineering team that provides additional integration support, certification assistance, and custom design and build services to get your products to market smarter and faster.

Yocto-ProjektEdge Vision AI Alliancekurbel-logo-sm.jpgdigi-trustfence-schild-sm.jpgWi-Fi-AllianzBluetoothAngetrieben von AWSST Autorisierter Partner  

Digi Produkt-Integration

Die Ingenieure von Digi WDS können die Hardwarekomponenten und Softwareprodukte von Digi anpassen, um Ihre Markteinführung zu beschleunigen.
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Vollständige Entwicklungsplattform

Die Digi IoT Entwicklungskits umfassen Platinen, Module und Zubehör für das schnelle Prototyping, Testen und Entwickeln von Wireless-Anwendungen.

Embedded Kits anzeigen
Bausätze
SKU: CC-WMP255-KIT Demnächst verfügbar
Digi ConnectCore MP255 Development Kit
  • Digi ConnectCore® MP255 development board with SOM
  • Konsolenanschlusskabel
  • Drahtlose Dual-Band-Antenne
  • Spannungsversorgung und Zubehör
  • Referenzdesigns und Online-Dokumentation
CC-WMP255-KIT Kontakt
Module
SKU: CC-WST-J17D-NK Demnächst verfügbar
Digi ConnectCore MP255 Secure Wireless System-On-Module
  • STMicroelectronics® STM32MP255F, Arm® 64-bit dual Cortex®-A35 at 1.5 GHz
  • Cortex-M33 at 400 MHz with FPU/MPU
  • Cortex M0+ at 200 MHz in SmartRun domain
  • 3D GPU, ISP, NPU
  • 1 GB DDR4,  8 GB eMMC, Secure boot
  • Indusrial operating temperature: −40 to 85 °C (−40 to 185 °F)
  • 2x Gigabit Ethernet (+ 1x Gigabit Ethernet option for 2+1 switch)
  • Wi-Fi 5 dual-band 802.11a/b/g/n/ac 
  • Bluetooth® 5.2 (Basisrate, erweiterte Datenrate und Bluetooth Low Energy)
CC-WST-J17D-NK Kontakt
SKU: CC-ST-J17D-ZK Demnächst verfügbar
Digi ConnectCore MP255 Secure Ethernet System-On-Module
  • STMicroelectronics® STM32MP255F, Arm® 64-bit dual Cortex®-A35 at 1.5 GHz
  • Cortex-M33 at 400 MHz with FPU/MPU
  • Cortex M0+ at 200 MHz in SmartRun domain
  • 3D GPU, ISP, NPU
  • 1 GB DDR4,  8 GB eMMC, Secure boot
  • Indusrial operating temperature: −40 to 85 °C (−40 to 185 °F)
  • 2x Gigabit Ethernet (+ 1x Gigabit Ethernet option for 2+1 switch)
CC-ST-J17D-ZK Kontakt
Zubehör
SKU: CC-ACC-LCDH-10 LCD-Applikationskit, einschließlich 10-Zoll-WXGA-LCD-Panel (hohe Auflösung) CC-ACC-LCDH-10 Wie Sie kaufen
Dienstleistungen und Support
Cloud Services
Digi ConnectCore® Cloud Services enable OEMs in a wide range of industries to create connected devices with remote-dashboard, -service and -application capabilities using Digi ConnectCore system-on-modules (SOMs).
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Security Services
Maintaining the security for connected devices after product release is challenging. Digi ConnectCore® Security Services enable customers to keep products secure.
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Support Services
Holen Sie sich die Hilfe, die Sie für die Bereitstellung, Verwaltung, Verbindung, Anpassung und Verbesserung Ihrer Digi-Lösung benötigen.
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Wireless Design Services
Die Wireless Design Services von Digi helfen Unternehmen bei der Lösung von Geschäftsproblemen, indem sie Wireless-Technologien zur Entwicklung innovativer M2M-Produkte einbinden.
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SPEZIFIKATIONEN Digi ConnectCore® MP255 SOM
ANWENDUNGSPROZESSOR STMicroelectronics STM32MP255F, Arm® 64-bit dual Cortex®-A35 at 1.5 GHz;
Cortex-M33 at 400 MHz with FPU/MPU;
Cortex M0+ at 200 MHz in SmartRun domain
SPEICHER Up to 128 GB Flash (eMMC™), up to 2 GB DDR4 (16-bit)
PMIC STMicroelectronics Power Management IC — STPMIC25A
NPU / ISP Neural Processing Unit (NPU) — VeriSilicon® at 900 MHz, 1.35 TOPS
VIDEO / GRAFIKEN 3D GPU — VeriSilicon at 900 MHz; OpenGL® ES 3.2.8 — Vulkan 1.2; Open CL™ 3.0, OpenVX™ 1.3; up to 138 Mtriangle/s, 900 Mpixel/s;
LCD-TFT controller, up to 24-bit digital RGB888; up to FHD (1920 x 1080) at 60 fps, 3 layers including a secure layer; YUV support, 90° output rotation;
MIPI DSI®, 4x data lanes, up to 2.5 Gbit/s each; up to QXGA (2048 x 1536) at 60 fps;
FPD-1 and OpenLDI JEIDA/VESA (LVDS), 1x link of 4x data lanes, up to 1.1 Gbit/s each, up to 1080p at 60 fps
KAMERA Camera interface #1 (5 Mpixels at 30 fps); MIPI CSI-2®, 2x data lanes up to 2.5 Gbit/s each; 8- to 16-bit parallel, up to 120 MHz; RGB, YUV, JPG, RawBayer with basic ISP, downscaling, cropping, 3-pixel pipelines;
Camera interface #2 (1 Mpixels at 15 fps); 8- to 14-bit parallel, up to 80 MHz; RGB, YUV, JPG, cropping;
Digital parallel interface up to 16-bit input or output
SICHERHEIT Secure boot, TrustZone® peripherals, up to 8 tamper input pins + 8 active tamper output pins, 1x CRC calculation unit, 2x cryptographic processors, hardware acceleration with DMA support; environmental monitors, display secure layers;
Encryption/decryption: AES-128/192/256, DES/TDES; secure AES-256 with SCA; RSA, ECC, ECDSA with SCA; HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC; true random number generator; “on-the-fly” DDR encryption/decryption (AES-128); “on-the-fly” OTFDEC Octo-SPI flash memory decryption (AES-128);
Complete resource isolation framework;
Digi TrustFence embedded security framework
PERIPHERIEGERÄTE / SCHNITTSTELLEN 8x I2C FM+ (1 Mbit/s, SMBus/PMBus®); 4x I3C (12.5 Mbit/s); 5x UART + 4x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave);
8x SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock);
4x SAI (stereo audio: I2S, PDM, SPDIF Tx);
SPDIF Rx with 4 inputs;
3x SDMMC up to 8-bit, out of which one is used for eMMC and one for Wi-Fi;
up to 3x CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN);
1x USB 2.0 high-speed Host with embedded 480 Mbits/s PHY;
1x USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express);
1x USB Type-C® Power Delivery control with two CC lines PHY;
1x PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed);
up to 172 secure I/O ports with interrupt capability; up to 6 wake-up inputs; up to 8 tamper input pins + 8 active tamper output pins;
3x ADCs with 12-bit max. resolution (up to 5 Msps each, up to 24 channels);
Internal temperature sensor;
1x multifunction digital filter (MDF) with up to 8 channels/8 filters;
1x audio digital filter with 1 filter and sound activity detection;
Internal or external ADC reference VREF+;
4x 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input;
3x 16-bit advanced motor control timers;
10x 16-bit general-purpose timers (including 2 basic timers without PWM);
5x 16-bit low-power timers;
Secure RTC with subsecond accuracy and hardware calendar;
up to 2x 4 Cortex-A35 system timers (secure, non-secure, virtual, hypervisor);
2x SysTick M33 timer (secure, non-secure);
1x SysTick M0+ timer;
7x watchdogs (5x independent and 2x window)
ETHERNET 2x Gigabit Ethernet with external PHY interfaces, optional 3x Gigabit Ethernet GMAC interfaces and 2+1 switch with STM32MP257F MPU;
TSN, IEEE 1588v2 hardware, MII/RMII/RGMII
WIRELESS Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with strong WPA3-Enterprise authentication/encryption;
−40 °C to 85 °C (−40 °F to 185 °F) full temperature range; Bluetooth 5.2 (Basic Rate, Enhanced Data Rate and Bluetooth Low Energy)
BETRIEBSTEMPERATUR Industriell: -40 °C bis 85 °C (-40 °F bis 185 °F); je nach Anwendungsfall und Gehäuse-/Systemdesign
LAGERTEMPERATUR -50 °C bis 125 °C (-58 °F bis 257 °F)
RELATIVE FEUCHTE 5% bis 90% (nicht kondensierend)
RADIO APPROVALS* USA, Kanada, EU, Japan, Australien/Neuseeland, Brasilien, Mexiko
EMISSIONS/ IMMUNITY/ SAFETY* FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024
EN 301 489-3, Safety (IEC 62368-1); visit product certifications for latest updates
DESIGN VERIFICATION* Temperatur: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; Vibration/Schock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MONTAGE / PINANZAHL Digi SMTplus (30 mm x 30 mm) surface mount footprint using 333-pad LGA (1.27 mm pitch) with option for simple carrier board designs supporting subset of interfaces
MECHANISCHE ABMESSUNGEN 30 mm x 30 mm x 3 mm (1.18 in x 1.18 in x 0.12 in)
PRODUKTGARANTIE 3-Jahres

*Visit product certifications for latest certifications and updates.
 

The information provided is preliminary and may be subject to change without notice.

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